| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor, which has low melt viscosity, has extremely low wire flow rate caused due to a molten resin, and is excellent in formability, wherein the cured product obtained by the resin composition has a small coefficient of linear expansion. <P>SOLUTION: The resin composition for sealing the semiconductor comprises, as essential components, a biphenyl-type epoxy resin (A), a nitrogen-containing phenol resin (B) having an imidazolidinone skeleton in its center, a curing accelerator (C), and a spherical silica (D), wherein the spherical silica accounts for 80-95 mass% of the resin composition. A resin-sealed semiconductor device is configured by compression-molding the resin composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
