发明名称 |
Light emitting diode package with a phosphor substrate |
摘要 |
Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate. |
申请公布号 |
US8143634(B2) |
申请公布日期 |
2012.03.27 |
申请号 |
US20070000958 |
申请日期 |
2007.12.19 |
申请人 |
PARK JUNG KYU;KIM YU DONG;CHOI SEUNG HWAN;JOO SEONG AH;SAMSUNG LED CO., LTD. |
发明人 |
PARK JUNG KYU;KIM YU DONG;CHOI SEUNG HWAN;JOO SEONG AH |
分类号 |
H01L33/00;H01L33/50;H01L33/56;H01L33/62 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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