SUBSTRATE FOR POWER MODULE, METHOD OF MANUFACTURING SUBSTRATE FOR POWER MODULE, AND POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a power module capable of suppressing occurrence of waviness and wrinkle on the surface of a circuit layer during cold cycle load, and suppressing a thermal stress from acting on a junction interface between a ceramics substrate and the circuit layer, being excellent in thermal cycle reliability.

SOLUTION: In a substrate 10 for a power module, a circuit layer 12 is joined to one surface of a ceramic substrate 11, with an electronic component mounted on the surface of the circuit layer 12. The circuit layer 12 is made from aluminum alloy of precipitation dispersion type in which precipitation particles are dispersed in parent phase of aluminum. Based on the observation with a scanning electron microscope of the cross section of the circuit layer 12, a precipitation deficient layer 12A of which the presence ratio of precipitation particles whose particle size is 0.1 μm or larger is less than 3% is formed at the junction interface portion of the circuit layer 12 with the ceramics substrate 11. On one surface side of the circuit layer 12, the presence ratio of precipitation particles whose particle size is 0.1 μm or larger is 3% or higher.

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