发明名称 |
HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
Disclosed herein is a heat-radiating substrate, including: a copper substrate; an alumina layer formed on one side of the copper substrate; a first circuit layer formed on the alumina layer; and a second circuit layer formed on the first circuit layer, wherein a heat-radiating element is mounted on a first pad of the first circuit layer or a second pad of the second circuit layer, or is directly mounted on the exposed side of the copper substrate after forming an opening on the alumina layer. |
申请公布号 |
US2012067623(A1) |
申请公布日期 |
2012.03.22 |
申请号 |
US201113007414 |
申请日期 |
2011.01.14 |
申请人 |
PARK SUNG KEUN;LIM CHANG HYUN;CHOI SEOG MOON;KIM KWANG SOO;KANG JUNG EUN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK SUNG KEUN;LIM CHANG HYUN;CHOI SEOG MOON;KIM KWANG SOO;KANG JUNG EUN |
分类号 |
H05K1/00;H05K3/02 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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