发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing floating capacitance and capable of achieving high speed and low power consumption by forming an element on a GaAs layer formed above a cavity in a GaAs device, and to provide a method of manufacturing the same. <P>SOLUTION: A semiconductor device comprises: a cavity 14 formed above a semiconductor substrate 11; a GaAs epitaxial layer 13 formed above the cavity 14; a gate electrode 15 formed on the GaAs epitaxial layer 13; and a pair of a source electrode 16 and a drain electrode 17 that are each formed on the GaAs epitaxial layer 13 so as to sandwich the adjacent gate electrode 15. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012059949(A) 申请公布日期 2012.03.22
申请号 JP20100202167 申请日期 2010.09.09
申请人 TOSHIBA CORP 发明人 CHIN SHOSHICHI
分类号 H01L21/338;H01L21/28;H01L29/812 主分类号 H01L21/338
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