发明名称 CONTACTING MEANS AND METHOD FOR CONTACTING ELECTRONIC COMPONENTS
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for connecting at least two components in which a sintering preform is used. <P>SOLUTION: The preform includes a carrier having a surface that has at least one structuring element containing a hardened paste. The hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids having 1-4 carbon atoms, (b5) esters of organic acids having 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012060114(A) 申请公布日期 2012.03.22
申请号 JP20110190564 申请日期 2011.09.01
申请人 HERAEUS MATERIALS TECHNOLOGY GMBH & CO KG 发明人 MICHAEL SCHAEFER;WOLFGANG SCHMIDT
分类号 H05K3/12;B22F1/02;H01L21/52;H05K3/34 主分类号 H05K3/12
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