| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate mounting method of an electronic component capable of suppressing a crack from occurring in a bonded interface without using a solder material and a substrate on which the electronic component is mounted. <P>SOLUTION: A surface mounting method of an electronic component 40 comprises: a step of providing a conductivity circuit 21 and a resist 30 composed of a thermoplastic resin formed on the surface side of the conductivity circuit 21 on an insulating base material 10; a step of providing a metal layer 50 on the surface of an electrode 41 of an electronic component 40; and a step of partly removing the resist 30 via melting to join the metal layer 50 and the conductivity circuit 21 by applying load by ultrasonic waves which vibrate in the direction substantially parallel to the surface of the metal layer 50 while pushing the metal layer 50 of the electronic component 40 against the resist 30, eliminating the load applied by the ultrasonic wave vibration, and curing the melted thermoplastic resin by cooling. The metal layer 50 is composed of a thin layer composed of a material in which the shear strength of the metal layer 50 is lower than the shear strength of the material that constitutes the conductivity circuit 21. <P>COPYRIGHT: (C)2012,JPO&INPIT |
