发明名称 |
A method for forming thermal barrier coating and device with the thermal barrier coating |
摘要 |
A method for forming a thermal barrier coating (60) for a device having a substrate (62) is provided. The method includes depositing a bond coat layer (66) onto the substrate (62), depositing an insulating layer (70) onto the bond coat layer (66), characterized in that the insulating layer (70) is deposited by selective laser melting. |
申请公布号 |
EP2431495(A1) |
申请公布日期 |
2012.03.21 |
申请号 |
EP20100177333 |
申请日期 |
2010.09.17 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
LAMPENSCHERF, STEFAN;WALTER, STEFFEN |
分类号 |
C23C24/10;C23C26/02;C23C28/00;F01D5/28 |
主分类号 |
C23C24/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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