发明名称 On-chip heater and methods for fabrication thereof and use thereof
摘要 An on-chip heater and methods for fabrication thereof and use thereof provide that the heater is located within an isolation region that in turn is located within a semiconductor substrate. The heater has a thermal output capable or raising the semiconductor substrate to a temperature of at least about 200° C. The heater may be used for thermally annealing trapped charges within dielectric layers within the semiconductor structure.
申请公布号 US8138573(B2) 申请公布日期 2012.03.20
申请号 US20100766342 申请日期 2010.04.23
申请人 CANNON ETHAN H.;STRONG ALVIN W.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CANNON ETHAN H.;STRONG ALVIN W.
分类号 H01L31/115 主分类号 H01L31/115
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