| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plating apparatus for rolling, which can reduce the occurrence of non-plating when plating a roll peripheral surface being an object to be plated. <P>SOLUTION: The plating apparatus for rolling includes: a pair of roll chucks configured to chuck both ends of a roll to be plated, energize the roll as a cathode, and rotate around a shaft; a plating tank for storing a plating solution and immersing the roll in the plating solution; an anode provided in the plating tank; and one or more non-conductive roll that comes into parallel contact with the peripheral surface of the roll in the plating tank and can rotate together with the rotation of the roll. <P>COPYRIGHT: (C)2012,JPO&INPIT |
