| 摘要 |
<p>The invention relates to a vacuum coating method with very high deposition rates at high layer thickness homogeneity and material yield as well as apparatuses for achieving the coating. In order to overcome the existing conflict between layer thickness homogeneity on the one side and material yield and coating rate on the other side reducing the classic vacuum evaporation, the substrate forms the boundary of an essentially closed coating chamber which is supplied by an evaporation source. The walls of this coating chamber as well as all surfaces which are not to be coated are either kept at a certain temperature or provided with a non-stick coating such that the vapor cannot condensate thereon and is scattered back into the coating chamber. Thereby, a very high vapor pressure is created in the coating chamber which leads to a very high condensation rate onto the substrate and to a homogenization of the layer thickness. Since the substrate is the only surface on which the vapor may condensate, the amount of material that is lost is very low and the yield is extremely high. Through the use of a pulsed operation of the evaporation source, a short cycle coating can be realized.</p> |
