发明名称 LASER BEAM MACHINING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To prevent fixing of a movable part of a work transport mechanism, etc. by suppressing scattering of droplets, generated with processes, and containing a protective film component, to the movable part, on the occasion of forming a protective film on a work and removing it from the work. <P>SOLUTION: A laser beam machining device 1 includes a casing 28 having an opening part 27 at the top surface, a protective film forming/removing table 26 holding a wafer W and capable of housing inside the casing 28, a washing nozzle 32 for washing a worked surface of the wafer W provided inside the casing 28, and a shutter mechanism 30 for covering the opening part 27 when washing the wafer W. The shutter mechanism 30 includes a sheet member 33 capable of covering the opening part 27, a winding roller 34 on which the sheet member 33 is wound, and a sheet member holding part 36 which holds an end of the sheet member 33 and is capable of sliding on a pair of guide rails 35 and 35 provided on the top surface of the casing 28 between an opening position where the opening part 27 is opened and a blocking position where the opening part 27 is blocked up. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012040571(A) 申请公布日期 2012.03.01
申请号 JP20100181193 申请日期 2010.08.13
申请人 DISCO CORP 发明人 IIZUKA KENTARO;SATO JUN
分类号 B23K26/42;B23K26/18;H01L21/301;H01L21/304;H01L21/683 主分类号 B23K26/42
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