| 摘要 |
A radiation-sensitive composition is described, which is comprised of (a) a polymer containing repeating units [1] represented by the general formula <CHEM> wherin R1 is a trivalent or tetravalent organic residue having at least two carbon atoms, R2 is a divalent organic residue having at least two carbon atoms, R3 is hydrogen or an alkali metal counter ion, and n is 1 or 2; (b) a compound containing a radiation-dimerizable or radiation-polymerizable unsaturated bond and an amino group or a quaternary ammonium salt; (c) a non-alicyclic organic compound having a boiling point not lower than 120 DEG C, containing at least one functional linkage selected from the group consisting of ester linkage, ether linkage and ketone linkage, and containing neither amino group nor hydroxyl group; and (d) optionally a sensitizer. This composition can greatly improve the developability and can give heat-resistant polyimide relief patterns with a good edge sharpness and good mechanical properties.
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