发明名称 |
Wafer manufacturing method and device |
摘要 |
The invention relates to a device for manufacturing semiconductor material wafers with a sawing device for the sawing of slices attached to a saw holder, a pre-cleaning device arranged in the process direction downstream of the sawing device for pre-cleaning the surfaces of the slices hanging on the saw holder, and a degluing device arranged downstream in the process direction for detaching the slices from the saw holder. |
申请公布号 |
US8123866(B2) |
申请公布日期 |
2012.02.28 |
申请号 |
US20070935269 |
申请日期 |
2007.11.05 |
申请人 |
DOEPPING JUERGEN;REINECKE MATTHIAS;BROSCHE HOLGER;GRETZSCHEL HANS-JOACHIM;POLLACK STEFFEN;DEUTSCHE SOLAR GMBH |
发明人 |
DOEPPING JUERGEN;REINECKE MATTHIAS;BROSCHE HOLGER;GRETZSCHEL HANS-JOACHIM;POLLACK STEFFEN |
分类号 |
C03C23/00;C23G1/00 |
主分类号 |
C03C23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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