发明名称 ADHERENCE APPARATUS OF CARRIER-TAPE USING CARRIER-PLATE FOR SEMICONDUCTOR
摘要 PURPOSE: An apparatus for sticking a carrier tape with an automatic cutting device is provided to improve the adhesion of a carrier tape by being repressed through a compressing roller. CONSTITUTION: A vacuum drum(20) includes one or more grooves for cutting. A cutting device cuts a carrier tape(4) while being vertically transferred. A vacuum transporter(40) includes a plurality of vacuum absorption plates(42). A compressing roller(50) is included in a lower part of a traveling direction of the vacuum transporter. A controller controls a coiled roller(10), the vacuum drum, the cutting device, and the vacuum transporter.
申请公布号 KR20120015361(A) 申请公布日期 2012.02.21
申请号 KR20120002164 申请日期 2012.01.06
申请人 SUNIL CO., LTD. 发明人 WOO, CHEON SIK;ANN, SEONG SU
分类号 H01L21/301 主分类号 H01L21/301
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