| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high frequency device, a terminal assembly structure, and an assembly method, which reduce work process and improve assembly efficiency. <P>SOLUTION: A high frequency device has a printed substrate, a pin header in which input and output terminal pins are fixed to a pin fixing member and which is mounted on the printed substrate, and a case housing the printed substrate. The pin fixing member has an engagement groove for fixing the pin header to the case, and the case has a pin header engagement part protruding from a side plate of the case toward the inner side of the case. The pin header engagement part is inserted into the engagement groove, thereby fixing the pin header to the case. <P>COPYRIGHT: (C)2012,JPO&INPIT |
