| 摘要 |
Provided is a circuit substrate manufacturing method, which is characterized in that the area other than a portion having a circuit chip arranged therein is made of such a green layer as is cured selectively before or after the circuit chip is arranged, and in that the green layer is used as a sheet circuit substrate sheet having such a softness that the circuit chip can be buried therein when the circuit chip arranged on its surface is depressed. According to the circuit substrate manufacturing method, the circuit chip can be highly precisely buried in the circuit substrate so that the circuit substrate can be manufactured simply and highly precisely. |
