The radiant heat circuit board and the method for manufacturing the same

摘要

PURPOSE: A heat dissipation circuit board and a manufacturing method thereof are provided to use a metal plate which includes a heat dissipation protrusion on the lower part of a mounting pad, thereby directly transferring heat emitted from a heating device to the metal plate. CONSTITUTION: A heat dissipation circuit board(100) comprises a metal plate(10), a bonding layer(20) arranged on the metal plate, an insulating layer(30) arranged on the bonding layer, and a circuit pattern(40) arranged on the insulating layer. The metal plate comprises a metallic protrusion(11) mounting a heating device(60). The bonding layer enhances adhesion between the metallic protrusion and solder(50). The insulating layer comprises epoxy insulation resin or polyimide resin. The circuit pattern is formed by patterning a conductive layer that is laminated on the insulating layer.