发明名称 PACKAGE FOR LIGHT EMITTING ELEMENT ACCOMMODATION CONTAINING ALUMINA AND BARIUM
摘要 [PROBLEMS] To provide a package for light emitting element accommodation that realizes enhanced reflectance without application of a metal plating onto a ceramic. [MEANS FOR SOLVING PROBLEMS] There is provided a package for light emitting element accommodation comprising ceramic substrate (2) having conductor mounting region (8) for mounting of light emitting element (1) on its upper surface; frame (4) of a light reflecting material containing 74.6 mass % or more of alumina whose average particle diameter after sintering is 2.5 μm or less, the frame (4) disposed on an upper surface of the substrate (2) in such a fashion that internal circumferential surface (7) of through-hole (3) expands outward; and light emitting element (1) mounted on the conductor mounting region (8) of the substrate (2). Thus, the reflectance of the frame (4) is enhanced without application of a metal plating thereonto.
申请公布号 US2012025255(A1) 申请公布日期 2012.02.02
申请号 US201113271013 申请日期 2011.10.11
申请人 KISHIMOTO KEIICHI;IDA MAKOTO;TERAISHI YOSHIAKI;NIPPON CARBIDE INDUSTRIES CO., INC. 发明人 KISHIMOTO KEIICHI;IDA MAKOTO;TERAISHI YOSHIAKI
分类号 H01L33/60;H01L33/48 主分类号 H01L33/60
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