| 摘要 |
<p>LOW DIELECTRIC GLASS AND FIBER GLASS FOR ELECTRONIC APPLICATIONSGlass compositions are provided that are useful in electronic applications, e.g., as reinforcements in printed circuit board substrates. Reduced dielectric constants are provided relative to E-glass, and fiber forming properties are provided that are more commercially practical than D-glass. Glass compositions comprise (in weight%); Si0260-68, Li20 0-2, B203 7-13 Na20 0-1, Al203 9-15 K20 0-1, MgO 8-15 Fe203 0-1, Ca0 0-4 F2 0-1, TiO2 0-2, other constituents 0-5.</p> |
