发明名称 |
Current-leveling electroplating/electropolishing electrode |
摘要 |
A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base electrode. The at least one sub-electrode has a width which is less than a width of the base electrode to impart a generally tapered, stepped or convex configuration to the current-leveling electrode. |
申请公布号 |
US8099861(B2) |
申请公布日期 |
2012.01.24 |
申请号 |
US20100854214 |
申请日期 |
2010.08.11 |
申请人 |
CHANG SHIH-CHIEH;WANG YING-LANG;CHEN KEI-WEI;LIN SHIH-HO;CHEN CHUN-CHANG;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHANG SHIH-CHIEH;WANG YING-LANG;CHEN KEI-WEI;LIN SHIH-HO;CHEN CHUN-CHANG |
分类号 |
B23P19/02;B23P19/04;B23P19/10;B23P19/12;C25D3/38;C25D17/12;C25D17/14 |
主分类号 |
B23P19/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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