发明名称 |
Integrated shielding for a package-on-package system |
摘要 |
An electronic package-on-package system with integrated shielding. The package-on-package system includes a first package having a first die and a second package having a second die and a substrate. The system also includes a conductive shield having a first portion and a second portion. The first portion is disposed between the first die and the second die and the second portion is disposed between the substrate and the first portion. The first portion is coupled to the second portion for shielding the first die from the second die.
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申请公布号 |
US2012012991(A1) |
申请公布日期 |
2012.01.19 |
申请号 |
US20100855376 |
申请日期 |
2010.08.12 |
申请人 |
CHANDRASEKARAN ARVIND;KIM JONGHAE;QUALCOMM INCORPORATED |
发明人 |
CHANDRASEKARAN ARVIND;KIM JONGHAE |
分类号 |
H01L23/556;H01L21/50;H01L23/538 |
主分类号 |
H01L23/556 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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