发明名称 |
FILM FOR SPACER FORMATION, SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE |
摘要 |
<p>A spacer formation film is adapted to be used for forming a spacer defining air-gap portions on a side of one surface of a semiconductor wafer and by being cut into a desired shape, the spacer formation film includes: a support base having a sheet-like shape; a spacer formation layer provided on the support base and having a bonding property, the spacer formation layer formed of a material containing an alkali soluble resin, a thermosetting resin and a photo polymerization initiator; and a cutting line along which the spacer formation film is to be cut, wherein the spacer formation layer is provided inside the cutting line so that a peripheral edge thereof is not overlapped to the cutting line.</p> |
申请公布号 |
EP2408008(A1) |
申请公布日期 |
2012.01.18 |
申请号 |
EP20100750657 |
申请日期 |
2010.02.19 |
申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
SHIRAISHI FUMIHIRO;KAWATA MASAKAZU;YONEYAMA MASAHIRO;TAKAHASHI TOYOSEI;DEJIMA HIROHISA;SATO TOSHIHIRO |
分类号 |
H01L23/10;C09J7/02;G03F7/09;H01L27/146 |
主分类号 |
H01L23/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|