| 摘要 |
<P>PROBLEM TO BE SOLVED: To constitute a structure which can treat both a 300 mm wafer and an 8-inch wafer in the aligner capable of angle alignment of centering, notching and the like, by holding the edge of a wafer. <P>SOLUTION: The structure comprises: a holding mechanism for holding the perimeter of a wafer by a switching operation; a rotation mechanism for rotating the holding mechanism to hold the wafer; and a sensor mechanism for detecting a specific shape of the perimeter of the wafer rotated by this rotation mechanism. In the aligner device of a wafer wherein the position of a wafer is determined by the operation of the holding mechanism, and the wafer is made to rotate to a desired direction by the rotation mechanism, the holding mechanism is equipped with at least two kinds of clampers 12 (12a-12d) and 13 (12a-12d) which can hold a wafer whose diameters differ. <P>COPYRIGHT: (C)2008,JPO&INPIT |
