| 摘要 |
An object of the invention is to provide a laser scribe processing method for use inprocessing of a hard and brittle material such as sapphire. An aspect of the present invention is a laser scribe processing method of forming a crack that runs along a scribe direction of a processing target substance using a light source that emits a laser beam, and an optical system for irradiation that leads the laser beam onto the processing target substance, the method including: an emission step of emitting a laser beam from the light source; a splitting step of splitting the laser beam into an ordinary light component and an extraordinary light component having different travel directions; a light converging step of converging the ordinary light component and the extraordinary light component to form multiple pairs of beam spots; and an irradiation step of intermittently irradiating with the laser beam having multiple pairs of beam spots in a scribe direction of the processing target substance. For splitting the ordinary light component and the extraordinary light component in the splitting step, a birefringent prism disposed in the optical system for irradiation may be used. |
