| 摘要 |
PURPOSE: A light emitting device and a semiconductor wafer are provided to implement a desired chip size and shape by exposing a substrate, a light transmission layer, a resin layer, and an overcoat electrode to outside. CONSTITUTION: In a light emitting device and a semiconductor wafer, a bonding layer(24) is formed on a substrate(10). A plurality of convex parts(40) comprises a first conductive layer, a light-emitting layer, and a second conductive layer A plurality of convex parts is formed on the bonding layer. A first electrode(52) is installed on the second conductive layer. A light transmission resin layer is formed around the convex part. A first overcoat electrode(54) has the first electrodes which are connected to each other. The first overcoat electrode is installed in the light transmission resin layer.
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