发明名称 |
Removal of process residues on the backside of a substrate |
摘要 |
A substrate is processed in a process chamber comprising a substrate support having a receiving surface for receiving a substrate so that a front surface of the substrate is exposed within the chamber. An energized process gas is used to process the front surface of the substrate. A peripheral edge of the backside surface of the substrate is cleaned by raising the substrate above the receiving surface of the substrate support to a raised position, and exposing the backside surface of the substrate to an energized cleaning gas. |
申请公布号 |
US8083963(B2) |
申请公布日期 |
2011.12.27 |
申请号 |
US20070695918 |
申请日期 |
2007.04.03 |
申请人 |
DELGADINO GERARDO A.;LAHIRI INDRAJIT;SU TEH-TIEN;SHIEH SY-YUAN BRIAN;SINHA ASHOK;APPLIED MATERIALS, INC. |
发明人 |
DELGADINO GERARDO A.;LAHIRI INDRAJIT;SU TEH-TIEN;SHIEH SY-YUAN BRIAN;SINHA ASHOK |
分类号 |
H01L21/461;C23F1/00 |
主分类号 |
H01L21/461 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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