| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a soldering jig and a soldering method which prevent solder connecting a first and a second components from remelting when a third component is soldered to the first components and second components which are already soldered. <P>SOLUTION: An upper electrode 54 is soldered to a semiconductor element 51 and a heat spreader 52, which are already soldered, by a soldering device 10. The jig has a heat radiating bar 24 which cools the semiconductor element 51 and the heat spreader 52 when the upper electrode 54 is soldered to prevent solder 53 connecting the semiconductor element 51 with the heat spreader 52 from remelting. <P>COPYRIGHT: (C)2012,JPO&INPIT |
