| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board having an embedded component, and a manufacturing method therefor, enabling manufacturing at low cost while maintaining reliability of a semiconductor device connection and functionality as a wiring board. <P>SOLUTION: The wiring board includes: a first insulation layer; a second insulation layer placed in a laminated shape relative to the first insulation layer; a semiconductor device having a terminal pad and being embedded in the second insulation layer; a first wiring pattern, sandwiched by, and contacting to, the first insulation layer and the second insulation layer, including a land for component connection that is covered by a silver film or a gold film formed by the aggregation of silver particles or gold particles, and neither being covered with the silver film nor the gold film excluding the surface layer of the land; a connection member for electrically conducting between the terminal pad of the semiconductor device and the land of the first wiring pattern; a resin disposed to seal the connection member inside the resin; and a second wiring pattern disposed on a surface side opposite to the surface side having the first wiring pattern of the first insulation layer thereon. <P>COPYRIGHT: (C)2012,JPO&INPIT |
