| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that shortens the time needed for a soldering process during the manufacture. <P>SOLUTION: A power card 1 that includes a high-side power element 11 and a low-side power element 21 to achieve cooling from both the sides comprises: a high-side electrode plate 12 connected to the high-side power element 11; a low-side electrode plate 22 connected to the low-side power element 21; and a middle-side electrode plate 30 connected to the high-side power element 11 and low-side power element 21. The middle-side electrode plate 30 is configured such that a high-side plate portion 31 to which the high-side power element 11 is connected and a low-side plate portion 35 to which the low-side power element 21 is connected are coupled together through a coupling portion 36 having small cross-sectional area. The coupling portion 36 is a remaining portion formed when slits 33 and 34 penetrating the middle-side electrode plate 30 along the thickness are formed. The slit 34 is extended in a coupling direction X at a periphery of the coupling portion 36. <P>COPYRIGHT: (C)2012,JPO&INPIT |
