发明名称 |
Vapor deposition system and vapor deposition method |
摘要 |
There is provided a device or a method including a flow path switching unit which switches a first flow path for releasing the vapor deposition material evaporated from a vapor depositing source from the same into a chamber, and a second flow path for causing the vapor deposition material evaporated from the vapor depositing source to flow from the vapor depositing source through a transfer path into a recovery container. The vapor deposition system or the vapor deposition method is capable of reducing an amount of a vapor deposition material consumed without being deposited on an object not to be processed during non-vapor deposition. |
申请公布号 |
US8062425(B2) |
申请公布日期 |
2011.11.22 |
申请号 |
US20060452196 |
申请日期 |
2006.06.14 |
申请人 |
YOSHIKAWA TOSHIAKI;FUKUDA NAOTO;CANON KABUSHIKI KAISHA |
发明人 |
YOSHIKAWA TOSHIAKI;FUKUDA NAOTO |
分类号 |
C23C16/00 |
主分类号 |
C23C16/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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