<p>Embodiments of the present disclosure provide a phosphorus-containing epoxy resin. Embodiments of the present disclosure further include a curable composition formed with the phosphorous-containing epoxy resin and a cured epoxy formed with the phosphorus-containing epoxy resin. For the various embodiments, the cured epoxy formed with the phosphorus-containing epoxy resin can have a glass transition temperature within a range of at least 150 degrees Celsius to 200 degrees Celsius and a thermal decomposition temperature of at least 330 degrees Celsius.</p>
申请公布号
WO2011100049(A3)
申请公布日期
2011.11.17
申请号
WO2011US00225
申请日期
2011.02.08
申请人
DOW GLOBAL TECHNOLOGIES LLC;MULLINS, MICHAEL, J.;THIBAULT, RAYMOND, J.;WILSON, MARK, B.
发明人
MULLINS, MICHAEL, J.;THIBAULT, RAYMOND, J.;WILSON, MARK, B.