| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for handling a semiconductor wafer which can prevent a semiconductor wafer from having a crack when peeling an adhesive tape adhering to an adhesion layer. <P>SOLUTION: A method for handling a semiconductor wafer 1 comprises: an adhesive sheet 11 with slight adhesiveness which adheres to a sheet support plate 10; the semiconductor wafer 1 which is bonded to a semiconductor support plate via an adhesion layer 3 and which has multiple chips 5 in the regions except a circumference 4. The multiple chips 5 of the semiconductor wafer 1 are adhered to the adhesive sheet 11 facing each other, the semiconductor support plate is peeled from the semiconductor wafer 1, and an adhesive tape 12 is adhered to the adhesion layer 3 which remains on the semiconductor wafer 1, in order to remove the adhesion layer 3 from the semiconductor wafer 1. A spacer 20 positioned at a peeling start position 13 in the circumference of the adhesive tape 12 is put and adhered firmly between the adhesive sheet 11 and the circumference 4 of the semiconductor wafer 1, which face each other, and then the adhesive tape 12 is gradually peeled from the peeling start position 13. <P>COPYRIGHT: (C)2012,JPO&INPIT |
