发明名称 ASSEMBLING DEVICE FOR FPD MODULE
摘要 PROBLEM TO BE SOLVED: To provide an assembling device for an FPD (Flat Panel Display) module, which prevents relative positional deviation between a TAB (Tape Automated Bonding) and a PCB (Printed Circuit Board) connected to a display substrate.SOLUTION: The assembling device for the FPD module includes a PCB transportation part 84, heaters 96A, 96B for preheating, cameras 85A, 85B, and a main pressure bonding part 76. The PCB transportation part 84 holds and transports the PCB 103. The heaters 96A, 96B for preheating contacts the PCB 103 held by the PCB transportation part 84 and preheats the PCB 103. The cameras 85A, 85B detect a position of the PCB 103 preheated by the heater. The main pressure bonding part 76 performs thermocompression bonding of the PCB 103 transported by the PCB transportation part 84 and the TAB 102 connected to the display substrate 101 based on a detection result of the cameras 85A, 85B.
申请公布号 JP2011209353(A) 申请公布日期 2011.10.20
申请号 JP20100074345 申请日期 2010.03.29
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 ISHIZAWA YASUAKI;YAMAZAKI FUJIO
分类号 G09F9/00;G02F1/13;H01L51/50 主分类号 G09F9/00
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