| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a high heat resistance, capable of obtaining a high adhesion and also having excellent optical characteristics and storage stability.SOLUTION: A polyene/polythiol-based photosensitive resin composition includes (A) (meth)acryloyl group-containing silicone compound, (B) thiol compound, (C) photopolymerizable monomer and (D) photo-radical polymerization initiator, and component (A) is ≥10 wt.% and ≤80 wt.%, component (B) is ≥1 wt.% and ≤80 wt.%, component (C) is ≥10 wt.% and ≤80 wt.% and component (D) is ≥0.1 wt.% and ≤5 wt.% to the sum total of components (A)-(D). |
