| 摘要 |
The present invention aims to enhance the heat dissipating performance of the imaging device. An imaging device includes a housing inducing an open region and being configured by a first material, a first substrate for illumination arranged to cover the open region inside the housing, a second substrate for imaging arranged in parallel to the first substrate inside the housing, and a heat dissipating member configured by a second material having a higher heat conductivity than the first material and being attached to a side surface of the housing so as to surround the open region of the housing. A concave is provided at the side surface of the housing. The heat dissipating member includes a projection that fits to the concave. |
