| 摘要 |
Disclosed is a circuit board (1) equipped with a first insulation layer (21) penetrated by a semiconductor; a first circuit layer (22) disposed at one side of the first insulation layer (21), connected to the semiconductor; a second insulation layer (23) that masks the first circuit layer (22) and is formed with an opening for exposing a portion of the first circuit layer (22); and a metallic layer (27) disposed inside the opening of the second insulation layer (23), that contacts a portion of the first circuit layer (22) that is exposed through the opening. Also, from the first circuit layer (22) side, in order, the metallic layer (27) is composed of a metallic layer (a) (271) that includes 55 µm or less of copper, of a thickness of 0 µm or more; a metallic layer (b) (272) that includes nickel of 15 µm or less, of a thickness of 2 µm or more; and a metallic layer (c) (273) that includes tin of 30 µm or less, of a thickness of 3 µm or more. |
