SEMICONDUCTOR LIGHT EMITTING DEVICE AND SUBMOUNT AND METHOD FOR FORMING THE SAME

摘要

PROBLEM TO BE SOLVED: To solve problems of the uniformity of emission and an optical image generated by a package, which are encountered in a conventional white LED package in general.

SOLUTION: A submount for a semiconductor light emitting device (12) includes a semiconductor substrate (14) having a cavity (16) therein configured to receive the light emitting device (12). A first bond pad (22A) is positioned in the cavity to couple to a first node of the light emitting device received in the cavity. A second bond pad (22B) is positioned in the cavity to couple to a second node of the light emitting device positioned therein. The light emitting device including a solid wavelength conversion member (32) and a method for forming the same are also provided.

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