| 摘要 |
<p>Disclosed is a Cu alloy film which has high adhesion to a transparent substrate or a semiconductor layer, a low electrical resistivity and excellent wet etching properties. Specifically disclosed is a Cu alloy film for use in a display device, which is an oxygen-containing alloy film that meets the following requirements (1) and (2): (1) the Cu alloy film contains at least one element selected from a group consisting of Ni, Al, Zn, Mn, Fe, Ge, Hf, Nb, Mo, W and Ca in the total amount of 0.10 to 10 at.% inclusive; and (2) the Cu alloy film has an under layer and a top layer having different oxygen contents from each other, wherein the under layer is contacted with the transparent substrate or the semiconductor layer and has an oxygen content higher than that in the top layer.</p> |
