| 发明名称 |
Interposer and method for producing the same and electronic device |
| 摘要 |
<p>An interposer includes a substrate (1) made of an inorganicmaterial; a through wiring (5) including conductors embedded in through holes; and an upper wiring (6). The imprint technique is used to form the through wiring.
</p> |
| 申请公布号 |
EP1758166(A3) |
申请公布日期 |
2011.09.21 |
| 申请号 |
EP20060017442 |
申请日期 |
2006.08.22 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SUNOHARA, MASAHIRO;TAGUCHI, YUICHI |
| 分类号 |
H01L23/498;H01L21/48;H01L23/14;H01L23/48;H05K1/11;H05K3/40;H05K3/44 |
主分类号 |
H01L23/498 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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