发明名称 |
LASER MACHINING METHOD AND LASER MACHINING DEVICE |
摘要 |
<p>In a method of laser-machining a work, a machining program is produced by using the arrangement position of a machining hole for the product, the arrangement position of an information recording area in which machining holes for information recording are arranged, and the machining hole for the product and the information recording area in which machining areas two-dimensionally scannable with a laser beam by a galvanoscanner are set. The machining program in which the machining area is set in the information recording area is modified by setting the position of the machining hole for information recording in accordance with the work in the information recording area. By using the modified machining program, the machining hole for information recording and the machining hole for the product are formed for each machining area.</p> |
申请公布号 |
KR20110102429(A) |
申请公布日期 |
2011.09.16 |
申请号 |
KR20117015688 |
申请日期 |
2009.04.15 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
INDOU KOUICHI;KANEDA ATSUHIRO |
分类号 |
B23K26/00;B23K26/382;G05B19/18;H05K3/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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