发明名称 LASER MACHINING METHOD AND LASER MACHINING DEVICE
摘要 <p>In a method of laser-machining a work, a machining program is produced by using the arrangement position of a machining hole for the product, the arrangement position of an information recording area in which machining holes for information recording are arranged, and the machining hole for the product and the information recording area in which machining areas two-dimensionally scannable with a laser beam by a galvanoscanner are set. The machining program in which the machining area is set in the information recording area is modified by setting the position of the machining hole for information recording in accordance with the work in the information recording area. By using the modified machining program, the machining hole for information recording and the machining hole for the product are formed for each machining area.</p>
申请公布号 KR20110102429(A) 申请公布日期 2011.09.16
申请号 KR20117015688 申请日期 2009.04.15
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 INDOU KOUICHI;KANEDA ATSUHIRO
分类号 B23K26/00;B23K26/382;G05B19/18;H05K3/00 主分类号 B23K26/00
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