发明名称 |
Semiconductor Packaging and Fabrication Method Using Connecting Plate for Internal Connection |
摘要 |
A semiconductor package with connecting plate for internal connection comprise: a plurality of chips each having a plurality of contact areas on a top surface; one or more connecting plates having a plurality of electrically isolated connecting plate portions each connecting a contact area of the semiconductor chips. The method of making the semiconductor package includes the steps of connecting one or more connecting plates to a plurality of semiconductor chips, applying a molding material to encapsulate the chips and the connecting plates, separating a plurality of connecting plate portions of the connecting plates by shallow cutting through or by grinding.
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申请公布号 |
US2011221008(A1) |
申请公布日期 |
2011.09.15 |
申请号 |
US20100722528 |
申请日期 |
2010.03.12 |
申请人 |
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发明人 |
LU JUN;LIU KAI;XUE YAN XUN |
分类号 |
H01L23/52;H01L21/70;H01L23/28;H01L27/088 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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