发明名称 GROUNDING STRUCTURE OF ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a grounding structure of an electronic equipment capable of reducing the number of components and reducing assembly man-hours than a conventional one without making the shape of a flexible lead complicated. SOLUTION: The electronic equipment has an electronic component mounted on a metal base plate 2, and a flexible lead 4 extracted from the electronic component is extended along a metal component 3 arranged at a position near the metal base plate 2. Here, a ground line in which a part of an insulation cover layer on the surface and the rear face is cut out is exposed on the surface and the rear face of the flexible lead 4; and a projection part 21 formed on the metal base plate 2 is pressure contacted to the ground line exposed part on the surface side of the flexible lead 4, and a projection part 31 formed on the metal component 3 is pressure contacted to the ground line exposed part on the rear face side of the flexible lead 4. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011175864(A) 申请公布日期 2011.09.08
申请号 JP20100039107 申请日期 2010.02.24
申请人 SANYO ELECTRIC CO LTD 发明人 TAKADA MASAHIKO
分类号 H05F3/02;H05K9/00 主分类号 H05F3/02
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