发明名称 |
DE-CLAMPING WAFERS FROM AN ELECTROSTATIC CHUCK |
摘要 |
One embodiment of the present invention relates to a method for declamping a semiconductor wafer that is electrically adhered to a surface of an electrostatic chuck by a clamping voltage. In this method, the clamping voltage is deactivated. For a time following the deactivation, a first region of the wafer is lifted an first distance from the surface of the electrostatic chuck while a second region of the wafer remains adhered to the surface of the electrostatic chuck. A predetermined condition is monitored during the time. The second region is lifted from the surface of the electrostatic chuck when the predetermined condition is met. |
申请公布号 |
KR20110098814(A) |
申请公布日期 |
2011.09.01 |
申请号 |
KR20117016004 |
申请日期 |
2009.12.10 |
申请人 |
AXCELIS TECHNOLOGIES, INC. |
发明人 |
PUROHIT ASHWIN;LEE WILLIAM D.;LAFONTAINE MARVIN;RZESZUT RICHARD |
分类号 |
H01L21/683;B23Q3/15;H01L21/687;H02N13/00 |
主分类号 |
H01L21/683 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|