Display panel, method of inspecting lead bonding of display panel, and lead bonding method of display panel

摘要

A display panel including a substrate and a plurality of films for carrying chips is provided. The substrate has a display region and a non-display region located at one side of the display region. The non-display region has a plurality of pad regions, and each pad region has a plurality of first leads and at least one first displacement measuring mark disposed therein. The first displacement measuring mark is located at at least one side of all the first leads. The films for carrying chips are correspondingly sticking on the substrate. Each film for carrying chips has a plurality of second leads and at least one second displacement measuring mark. The second displacement measuring mark is located at least one side of all the second leads and is corresponding to the first displacement measuring mark. The second leads are correspondingly connected with the first leads.