| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device inspecting a state of a sheet pasted to a plate-like member such as a semiconductor wafer, and to provide a sheet pasting device. SOLUTION: The sheet pasting device 10 is composed by including a pasting means 13 to paste an adhesive sheet S to a semiconductor wafer W, and the inspection device 21 for detecting a surface condition of the adhesive sheet S. The inspection device 21 includes a camera 70 as an inspection means to detect the surface condition. Detection data by the inspection means are output to a first information storing/processing means 52, and data subjected to predetermined processing by the first information storing/processing means 52 are input to a second information storing/processing means 53 mounted to a case 60 for storing the semiconductor wafer W therein. COPYRIGHT: (C)2011,JPO&INPIT |
