发明名称 MOUNTING COMPONENT, ELECTRONIC DEVICE, AND MOUNTING METHOD
摘要 A mounting component has a pad, a leg portion having a bottom surface thereof soldered to the pad, and an auxiliary hole made in a side face of the leg portion. The auxiliary hole is laterally opened so as not to be opened to the bottom surface. The auxiliary hole is operable to receive melted solder therein.
申请公布号 US2011201217(A1) 申请公布日期 2011.08.18
申请号 US201113016203 申请日期 2011.01.28
申请人 OMRON CORPORATION 发明人 KOYAMA JIRO;TERANISHI HIROTADA
分类号 H01R12/00;B23P19/00 主分类号 H01R12/00
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