发明名称 Controlled electrochemical polishing method
摘要 The invention relates to a method of polishing a substrate comprising at least one metal layer by applying an electrochemical potential between the substrate and at least one electrode in contact with a polishing composition comprising a reducing agent or an oxidizing agent.
申请公布号 US7998335(B2) 申请公布日期 2011.08.16
申请号 US20050150944 申请日期 2005.06.13
申请人 CABOT MICROELECTRONICS CORPORATION 发明人 FEENEY PAUL M.;BRUSIC VLASTA
分类号 C25F3/18 主分类号 C25F3/18
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