发明名称 |
Controlled electrochemical polishing method |
摘要 |
The invention relates to a method of polishing a substrate comprising at least one metal layer by applying an electrochemical potential between the substrate and at least one electrode in contact with a polishing composition comprising a reducing agent or an oxidizing agent.
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申请公布号 |
US7998335(B2) |
申请公布日期 |
2011.08.16 |
申请号 |
US20050150944 |
申请日期 |
2005.06.13 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
FEENEY PAUL M.;BRUSIC VLASTA |
分类号 |
C25F3/18 |
主分类号 |
C25F3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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