发明名称 PLASMA TREATMENT DEVICE AND PLASMA TREATMENT METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a remote type plasma treatment device and a plasma treatment method capable of efficiently supplying radicals alone after fully controlling charged particles reaching a treated material. <P>SOLUTION: A pressure in a discharge part is retained close to an atmospheric pressure, a pressure in a treatment chamber is retained to be lower than the pressure of the discharge part, a first electrode of a pair of electrodes is overlapped on a partition plate, air-tight connected thereto, and provided with pores respectively connected to a plurality of through holes, a second electrode of the pair of electrodes is arranged to face the first electrode with a predetermined gap therebetween, and a surface of the first electrode on the gap side and the surface of the second electrode on the gap side as well as an inner face of the pore are covered by a dielectric. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011154973(A) 申请公布日期 2011.08.11
申请号 JP20100017253 申请日期 2010.01.28
申请人 MITSUBISHI ELECTRIC CORP;TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEM CORP 发明人 OINUMA MANABU;INANAGA YASUTAKA;TANIMURA YASUHIRO;WATANABE KENSHI;HANADA MASAHITO
分类号 H05H1/24;C23C16/509;H01L21/205;H01L21/304;H01L21/3065 主分类号 H05H1/24
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