| 摘要 |
PROBLEM TO BE SOLVED: To maintain high vacuum in a cavity by suppressing leakage of air through an open hole for an eject pin, and also to facilitate assembly work and maintenance of dies. SOLUTION: A through hole 23 for the eject pin 30 formed in a movable die 20 includes a sliding part 23a that is formed on the cavity C side and through which a top portion of the eject pin 30 is inserted slidably, and a loosely fitting part 23b that is formed on the back side and has a larger cross section area than the sliding part 23a. A pressure reduction path 24 is formed in the cavity die 22 of the movable die 20 which communicates to the sliding part 23a. When the cavity C is vacuum-sucked to reduce pressure therein, the pressure in the sliding part 23a is simultaneously reduced via the pressure reduction path 24 so that air inside the through hole 23 is discharged through the pressure reduction path 24, thereby suppressing leakage of the air into the cavity C. COPYRIGHT: (C)2011,JPO&INPIT
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